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Materials

Material selection and integration is an essential facet of printed wiring board fabrication. Our expertise regarding advanced material types and combinations allows us to offer our customers a cost-effective solution for almost any design challenge. From high signal integrity to superior dimensional stability, trust Rigid-Flex Int. to make the optimal recommendation for every packaging challenge.

 

Isola - Copper-clad laminates & dielectric prepegs: A global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. Isola high-performance materials are used in a diverse range of electronic end-markets including applications in computers, networking and communications equipment, high-end consumer electronics, as well as products designed for use in the advanced automotive, aerospace, military and medical markets.

The company invests in research and development to create industry-leading products formulated to meet the most demanding performance requirements of its customers, the printed circuit board fabricators, and the designers and original equipment manufacturers (OEMs) they serve. The global footprint includes ten manufacturing facilities and three research centers located in Asia, Europe and the United States.   VIEW MATERIAL DATA SHEETS

 

Arlon - High performance laminate and prepreg materials: Materials for Electronics (MED) is a Division of Arlon LLC a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. These applications typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristic that exceed those of traditional standard FR-4 materials. Arlon Electronic Substrates specializes in thermoset resin technology including polyimide, high Tg multifunctional epoxy, and low loss thermoset laminate and prepreg systems. These resin systems are available on a variety of substrates including woven glass and non-woven aramid. Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCB’s (i.e. in mobile communication products). Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon thermoset laminates that deliver the electrical performance needed in frequency-dependent circuit applications such as base station antennas, phased array radars, power amplifier boards, communications systems, and various other antenna applications. An exciting product is a lower loss version of CLTE, called CLTE-XT. CLTE-XT has the lowest loss, lowest thermal expansion, highest phase stability, and lowest moisture absorption of any product in its class.  VIEW MATERIAL DATA SHEETS

 

Rogers - Step changes in wired & wireless communications circuits: Enabling step changes in high-frequency, high-speed performance for wired & wireless communications circuits worldwide with Advanced Circuit Material. Key Products/Brands include: RT/duriod High Frequency Laminates; RO4000 High Frequency Circuit Materials; RO3000 High Frequency Laminates; and TMM Thermoset Microwave Materials. For applications such as: Wireless Base Stations; Aerospace & Defense; Automotive; and High Speed Digital.VIEW MATERIAL SHEETS

 

Dupont - Materials for flexible and rigid-flex circuits: Electronics materials with a company with a deep understanding of materials science and a commitment to technology leadership, a wide range of process expertise and a long history of innovation. DuPont offers the industry’s broadest array of high performance electronic materials. The portfolio includes materials for rigid and flexible circuits including: Kapton, Pyralux, Interra and other advanced laminates.

Rigid-Flex Intl is a leader in design and fabrication of HIGH TEMPERATURE APPLICATION FLEX CIRCUITS for use in industries such as Oil & Gas Exploration (“down hole”), Medical Instrument Sterilization (“autoclave survivability”); Engine Controls (“under hood”) and Automotive Brakes and Transmissions as well as many defense (aircraft, missile and vehicles) and space exploration applications.VIEW MATERIAL SHEETS        DUPONT WEBSITE

 

Nelco - Superior thermal & mechanical performance: Circuit board materials that provide superior thermal and mechanical performance. All Nelco materials are RoHS compliant and many provide high thermal reliability and CAF resistance for lead-free assembly compatibility. Nelco is a reliable source with 50+ years of global materials experience. There are many material types available including FR-4, High-Tg and high speed epoxy materials and advanced materials such as BT, polyimide and cyanate ester.

Nelco PCB materials are designed for high layer count PCB and high speed digital applications such as lead–free assemblies, high speed / low loss and fine-line multilayers, backplanes, communications and networking services, wireless handsets and infrastructure, automotive and diverse mounting and packaging.VIEW MATERIAL SHEETS

 

Hanwha - Flexible Copper Clad Laminate, core in a flex circuit construction: Hanwha Advanced Materials has transformed itself into a “global high-tech materials maker” by concentrating its capacities on the material industry. In particular, the company has expanded its core business areas into composite materials for lightweight cars, electronics and solar energy, where it is able to compete effectively.

Korean manufacturer Hanwha produces FCCL (Flexible Copper Clad Laminate). THis material is a flexible unreinforced polyimide dielectric with copper clad to both sides. It is used as a core in a flex circuit construction. Hanwha materials have processing advantages over other manufacturers and can be more cost effective to work with.VIEW MATERIAL SHEETS

 

Ventec - Professional Manufacturer in Copper Clad Laminates: Ventec USA is the US subsidiary of Ventec Electronics (Suzhou) Co. Ltd and a member of the Ventec International Group of Companies. Ventec International Group is a world leader in the volume production of high quality and high performance copper clad laminates and pre pregs with full R&D and product development capabilities. Through its European and US subsidiaries Ventec offers customers Global reach with local service.

Ventec has a wide range of products servicing the prepreg and copper clad laminate markets. Including a full range of polyimide products, which encompasses prepregs for hole filling, (with low-flow and no-flow options) as well as standard Tg dicy-cured epoxy, we are constantly upgrading and developing our range.VIEW MATERIAL SHEETS

Rigid-Flex Int'l.
4065 E. La Palma Ave Suite F
Anaheim, Ca 92807
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